Greene Tweed’s ONX® 600, a fluoropolymer-based, carbon-fiber-reinforced composite, is a high-strength, high-purity material that withstands strong acid chemistries at high temperatures. Used in wafer cleaning, ONX® 600 is resistant to SPM (sulfuric-peroxide, Piranha), SC1 (ammonium hydroxide-peroxide), SC2 (HCl-peroxide), and dilute HF cleaning solutions. ONX® 600 is recommended for precision components, is stable to wet process temperatures up to 260°C (500°F), and is pure enough for applications that must contact the wafer edge. Moreover, because Silicon is harder than ONX® 600, edge damage and particles are minimized. Finally, ONX® 600 is electrically conductive to remove static charges caused by spin-spray actions, protecting delicate features of semiconductor devices.

Features & Benefits

Thermally stable – no deformation up to 260°C (500°F) exposure or with temperature cycling
High purity – ionics in low ppb range
Resistant to strong acids, bases, and solvents
Electrically conductive to protect against process related electrostatic discharge
Low cost

Applications

ONX® 600 materials are designed to be used across a wide range of applications. No matter how demanding the environment, our team works with you to determine the right solution for the job.

Applications include:

Precision wafer chuck assemblies
Wafer clamps
Wafer pins
Screws

Need something more custom?
Add this to your quote and we can discuss your requirements.