Chemraz® 663

Chemraz® 663, a perfluoroelastomer (FFKM), is engineered to withstand low-temperature Etch and Deposition applications where plasma resistance and the ability to maintain sealing force in a vacuum are critical, such as electrostatic chuck assemblies.

Features & Benefits

Exceptional plasma performance at low temps

Applications

Deposition
Conductor Etch
Dielectric Etch
Electrostatic chuck (ESC)
Low-temperature, vacuum environments

Configurations

Electrostatic chuck (ESC)
Low-temperature
Vacuum environments

Temperature Range

–40°C to 180°C (–40°F to 356°F)

For applications facing extreme temperatures, high pressures, or uniquely challenging operating conditions, our global engineering team delivers fully custom‑engineered solutions. Because every critical environment is different, these designs are developed in close collaboration with you—let’s discuss your requirements to build the right solution.

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