Chemraz® G57

Do you need custom-engineered wafer processing seals that meet the demands of aggressive dry plasma systems? Chemraz® G57’s unique formulation provides improved plasma resistance and minimizes contamination, resulting in less downtime and higher wafer processing yields in both static and dynamic applications.

Chemraz® G57 is an FFKM compound with high temperature capability and excellent O2 plasma compatibility, boasting excellent chemical resistance and maximum temperature operation to 572°F (300°C).

Features & Benefits

Excellent plasma resistance in a variety of aggressive chemical environments
High service temperatures up to 572°F / 300°C
Minimal particulation
Lower hardness for easy installation
Lower sticking properties for dynamic applications
Available as O-ring, custom CXs, and slabs – with no restrictions on availability
Global manufacturing capabilities

Applications

Endpoint windows
Seals
Dy plasma etch
Deposition
Metalization
Remote plasma cleans
Dry ashing
Oxidation
Diffusion

Configurations

Endpoint windows
Bell jar seals
Valve seals
KF fitting seals
Window seals
Isolator valve seals
Lid seals
Gas inlet seals
Slit valve seals
Chamber seals

Resources

Chemraz® G57 Minimal Contamination in Dry Plasma Etching Processes

Need something more custom?
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