Chemraz® 629 FFKM is specifically developed by Greene Tweed to meet the rigorous demands of aggressive plasma systems. Its unique formulation provides enhanced plasma resistance in oxygen and fluorine plasma processes, resulting in minimal contamination, less downtime, and higher wafer processing yields.
For applications facing extreme temperatures, high pressures, or uniquely challenging operating conditions, our global engineering team delivers fully custom‑engineered solutions. Because every critical environment is different, these designs are developed in close collaboration with you—let’s discuss your requirements to build the right solution.