Chemraz® 551

With its broad chemical resistance, Chemraz® 551 is ideally suited as a universal sealing material for both aqueous and dry semiconductor wafer processing and chemical/DI water distribution systems. With the lowest outgassing profile for perfluoroelastomer materials in high-temperature applications, Chemraz® 551 provides a cleaner process environment. Because of its reduced surface stiction, it can be used for semi-dynamic and static applications. Chemraz® 551 remains stable at operating temperatures up to 572°F (300°C), while maintaining exceptional compression set.

Features & Benefits

Broad chemical compatibility
High temperature capability (up to 600°F/316°C)
Excellent compression set maintains seal integrity in wide temperature and pressure variations as well as vibration
Breadth of capabilities allows for standardization on one material and reduces inventory line items
Longer and better seal integrity in seal applications
Lower overall equipment cost of operation
World class cleanliness in semiconductor and wet applications

Applications

Chamber seals
Dispensing seals
Fitting and union seals
Filter seals
Gas inlet/outlet seals
Gaskets
Gate valve seals
Isolator valve seals
Reaction chamber lid seals
Regulator seals
Seals in close proximity to high-temperature water heaters
Slit valve seals
Tube capping seals
Valve seals

Configurations

Atomic layer deposition
Electrochemical plating
Epitaxial deposition
LPCVD (silicon nitride, silicon oxide)
Photolithography track pre-cleaning
RTP (annealing, oxidation, nitridation, silicidation)
Silicon water ingot growing
SOI annealing
Typical etch & deposition plasma gases, including NF3 and O2
Thermal CVD
Wet cleaning (batch and single wafer)
Wet etch (oxide, nitride, metal)
Wet photo resist strip (acid, solvent)

Temperature Range

-12°C to 316°C (10°F to 600°F)

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